Peeling by Pulling: Characterizing the Mechanical Behavior of Nanoscale Thin Films

نویسندگان

چکیده

The flexible and clinging nature of ultra-thin films require the understanding their elastic adhesive properties in a wide range circumstances from fabrications to applications. Simultaneously measuring both properties, however, is extremely difficult as film thickness diminishes nanoscales. In this talk, I will show our recent work that addresses such difficulties through peeling by vertically pulling thin off substrates (we thus refer it “pull-to-peel”). Particularly, we perform in-situ pull-to-peel graphene MoS2 scanning electron microscope achieve simultaneous determination Young’s moduli adhesions gold substrates. This striking contrast other conceptually similar tests available literature, including indentation (only elasticity) spontaneous blisters adhesion). Furthermore, weakly nonlinear Hooke’s relation for response two-dimensional materials, which may be harnessed design nanoscale force sensors or exploited thin-film systems.

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ژورنال

عنوان ژورنال: International Conference on Computational & Experimental Engineering and Sciences online version

سال: 2023

ISSN: ['1933-2815']

DOI: https://doi.org/10.32604/icces.2023.09223